CPC Subgroup
H01P 5/022 Full Title
Coupling devices of the waveguide type > with invariable factor of coupling (H01P5/12 takes precedence )
Filing statistics
CPC H01P 5/022 belongs to the parent subclass H01P, which recorded 38,823 patent applications worldwide between 2013 and 2023. Annual filings grew from 2,104 in 2013 to 3,286 in 2023 (+56%), peaking at 4,442 applications in 2019. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
3 direct subcodes
Child Classifications
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Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080