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CPC Main Group
H01T 1/00

Details of spark gaps

Filing statistics

CPC H01T 1/00 belongs to the parent subclass H01T, which recorded 13,254 patent applications worldwide between 2013 and 2023. Annual filings declined from 1,160 in 2013 to 705 in 2023 (-39%), peaking at 1,619 applications in 2018. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

8 direct subcodes

Child Classifications

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  • H01T 1/12 Means structurally associated with spark gap for recording operation thereof
  • H01T 1/14 Means structurally associated with spark gap for protecting it against overload or for disconnecting it in case of failure (H01T1/15, H01T1/16, H01T1/18 take precedence; emergency protective circuit arrangements for spark gap arrestors H02H7/24)
  • H01T 1/15 for protection against excessive pressure
  • H01T 1/16 Series resistor structurally associated with spark gap
  • H01T 1/18 Electrolytic device structurally associated with spark gap
  • H01T 1/24 Selection of materials for electrodes (H01T1/22 takes precedence)

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080