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CPC Subgroup
H02B 1/044

Mounting through openings

Full Title

Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements > Boards, panels, desks; Parts thereof or accessories therefor > Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing > Mounting through openings

Filing statistics

CPC H02B 1/044 belongs to the parent subclass H02B, which recorded 54,590 patent applications worldwide between 2013 and 2023. Annual filings grew from 2,207 in 2013 to 5,971 in 2023 (+171%), peaking at 7,357 applications in 2020. The most active applicants in class H02 are SGCC(STATE GRID CORPORATION OF CHINA) (24,515 applications), MITSUBISHI ELECTRIC CORPORATION (11,346 applications) and SIEMENS (9,026 applications).

Source: EPO PATSTAT, worldwide filings

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349