CPC Subgroup
H02J 3/1821 using shunt compensators
Full Title
Circuit arrangements for AC mains or AC distribution networks > Arrangements for adjusting, eliminating or compensating reactive power in networks > using shunt compensators
Filing statistics
CPC H02J 3/1821 belongs to the parent subclass H02J, which recorded 413,281 patent applications worldwide between 2013 and 2023. Annual filings grew from 20,350 in 2013 to 53,237 in 2023 (+162%). The most active applicants in class H02 are SGCC(STATE GRID CORPORATION OF CHINA) (24,515 applications), MITSUBISHI ELECTRIC CORPORATION (11,346 applications) and SIEMENS (9,026 applications).
Source: EPO PATSTAT, worldwide filings
3 direct subcodes
Child Classifications
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- H02J 3/1828 with stepwise control, e.g. switched capacitor banks
- H02J 3/1835 with stepless control
Top Applicants
Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349