CPC Main Group
H02J 50/00 Circuit arrangements or systems for wireless supply or distribution of electric power
Filing statistics
CPC H02J 50/00 belongs to the parent subclass H02J, which recorded 413,281 patent applications worldwide between 2013 and 2023. Annual filings grew from 20,350 in 2013 to 53,237 in 2023 (+162%). The most active applicants in class H02 are SGCC(STATE GRID CORPORATION OF CHINA) (24,515 applications), MITSUBISHI ELECTRIC CORPORATION (11,346 applications) and SIEMENS (9,026 applications).
Source: EPO PATSTAT, worldwide filings
13 direct subcodes
Child Classifications
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- H02J 50/05 using capacitive coupling
- H02J 50/10 using inductive coupling
- H02J 50/15 using ultrasonic waves
- H02J 50/20 using microwaves or radio frequency waves
- H02J 50/30 using light, e.g. lasers
- H02J 50/40 using two or more transmitting or receiving devices (H02J50/50 takes precedence)
- H02J 50/50 using additional energy repeaters between transmitting devices and receiving devices
- H02J 50/60 responsive to the presence of foreign objects, e.g. detection of living beings
- H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
- H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
- H02J 50/90 involving detection or optimisation of position, e.g. alignment
Top Applicants
Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349