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CPC Subgroup
H02K 15/047

Distributed windings

Full Title

Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines > of windings prior to their mounting into the machines (insulating windings H02K15/10, H02K15/12) > winding non-flat conductive wires, e.g. cables or cords > Distributed windings

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349