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CPC Main Group Additional Only
H02K 2203/00

Specific aspects not provided for in the other groups of this subclass relating to the windings

5 direct subcodes

Child Classifications

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  • H02K 2203/03 Machines characterised by the wiring boards, i.e. printed circuit boards or similar structures for connecting the winding terminations
  • H02K 2203/06 Machines characterised by the wiring leads, i.e. conducting wires for connecting the winding terminations
  • H02K 2203/09 Machines characterised by wiring elements other than wires, e.g. bus rings, for connecting the winding terminations
  • H02K 2203/12 Machines characterised by the bobbins for supporting the windings
  • H02K 2203/15 Machines characterised by cable windings, e.g. high-voltage cables, ribbon cables

Top Applicants

Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349