CPC Main Group Additional Only
H02K 2203/00 Specific aspects not provided for in the other groups of this subclass relating to the windings
5 direct subcodes
Child Classifications
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- H02K 2203/03 Machines characterised by the wiring boards, i.e. printed circuit boards or similar structures for connecting the winding terminations
- H02K 2203/06 Machines characterised by the wiring leads, i.e. conducting wires for connecting the winding terminations
- H02K 2203/09 Machines characterised by wiring elements other than wires, e.g. bus rings, for connecting the winding terminations
- H02K 2203/12 Machines characterised by the bobbins for supporting the windings
- H02K 2203/15 Machines characterised by cable windings, e.g. high-voltage cables, ribbon cables
Top Applicants
Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349