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PCE
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CPC Subgroup
H02K 5/128

using air-gap sleeves or air-gap discs

Full Title

Casings; Enclosures; Supports > Casings or enclosures characterised by the shape, form or construction thereof > specially adapted for operating in liquid or gas (combined with cooling arrangements H02K9/00) > using air-gap sleeves or air-gap discs

2 direct subcodes

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349