H02K 5/225 Full Title
Casings; Enclosures; Supports > Casings or enclosures characterised by the shape, form or construction thereof > Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
Filing statistics
CPC H02K 5/225 belongs to the parent subclass H02K, which recorded 252,453 patent applications worldwide between 2013 and 2023. Annual filings grew from 14,359 in 2013 to 24,242 in 2023 (+69%), peaking at 29,510 applications in 2020. The most active applicants in class H02 are SGCC(STATE GRID CORPORATION OF CHINA) (24,515 applications), MITSUBISHI ELECTRIC CORPORATION (11,346 applications) and SIEMENS (9,026 applications).
Source: EPO PATSTAT, worldwide filings
Top Applicants
Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349