CPC Subgroup Additional Only
H03B 2200/0014 Structural aspects of oscillators
Full Title
Indexing scheme relating to details of oscillators covered by H03B > Structural aspects of oscillators
7 direct subcodes
Child Classifications
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- H03B 2200/0016 including a ring, disk or loop shaped resonator
- H03B 2200/0018 relating to the cutting angle of a crystal, e.g. AT cut quartz
- H03B 2200/002 making use of ceramic material
- H03B 2200/0022 characterised by the substrate, e.g. material
- H03B 2200/0024 including parallel striplines
- H03B 2200/0026 relating to the pins of integrated circuits
- H03B 2200/0028 based on a monolithic microwave integrated circuit [MMIC]
Top Applicants
Top 10 applicants by patent filingsfor class H03, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,293
- QUALCOMM US 7,085
- MURATA MANUFACTURING COMPANY JP 5,982
- HUAWEI TECHNOLOGIES COMPANY CN 4,641
- INTEL CORPORATION US 3,863
- TEXAS INSTRUMENTS US 3,409
- MURATA MANUFACTURING COMPANY 2,874
- SK HYNIX KR 2,644
- SKYWORKS SOLUTIONS US 2,545
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437