CPC Subgroup Additional Only
H03C 2200/0037 Functional aspects of modulators
Full Title
Indexing scheme relating to details of modulators or modulation methods covered by H03C > Functional aspects of modulators
10 direct subcodes
Child Classifications
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- H03C 2200/0041 Calibration of modulators
- H03C 2200/0045 Pulse width, duty cycle or on/off ratio
- H03C 2200/005 Modulation sensitivity
- H03C 2200/0058 Quadrature arrangements
- H03C 2200/0062 Lowering the supply voltage and saving power
- H03C 2200/0066 Reduction of carrier leakage or the suppression of the carrier
- H03C 2200/007 with one sideband wholly or partially suppressed
- H03C 2200/0075 FM modulation down to DC
- H03C 2200/0079 Measures to linearise modulation or reduce distortion of modulation characteristics
- H03C 2200/0087 Measures to address temperature induced variations of modulation
Top Applicants
Top 10 applicants by patent filingsfor class H03, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,293
- QUALCOMM US 7,085
- MURATA MANUFACTURING COMPANY JP 5,982
- HUAWEI TECHNOLOGIES COMPANY CN 4,641
- INTEL CORPORATION US 3,863
- TEXAS INSTRUMENTS US 3,409
- MURATA MANUFACTURING COMPANY 2,874
- SK HYNIX KR 2,644
- SKYWORKS SOLUTIONS US 2,545
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437