CPC Subgroup
H03H 2/006 Full Title
Networks using elements or techniques not provided for in groups H03H3/00 - H03H21/00
Top Applicants
Top 10 applicants by patent filingsfor class H03, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,293
- QUALCOMM US 7,085
- MURATA MANUFACTURING COMPANY JP 5,982
- HUAWEI TECHNOLOGIES COMPANY CN 4,641
- INTEL CORPORATION US 3,863
- TEXAS INSTRUMENTS US 3,409
- MURATA MANUFACTURING COMPANY 2,874
- SK HYNIX KR 2,644
- SKYWORKS SOLUTIONS US 2,545
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437