relating to direct sequence modulation

Full Title

Indexing scheme relating to details of transmission systems not covered by a single group of H04B3/00 - H04B13/00 > Orthogonal indexing scheme relating to spread spectrum techniques in general > relating to direct sequence modulation

Filing statistics

CPC H04B 2201/707 belongs to the parent subclass H04B, which recorded 474,755 patent applications worldwide between 2013 and 2023. Annual filings grew from 34,313 in 2013 to 39,995 in 2023 (+17%), peaking at 50,387 applications in 2020. The most active applicants in class H04 are HUAWEI TECHNOLOGIES COMPANY (101,476 applications), QUALCOMM (101,139 applications) and SAMSUNG ELECTRONICS COMPANY (96,655 applications).

Source: EPO PATSTAT, worldwide filings

12 direct subcodes

Child Classifications

Navigate with arrow keys, Enter to open

H04B 2201/70701 featuring pilot assisted reception
H04B 2201/70702 Intercell-related aspects
H04B 2201/70703 using multiple or variable rates
H04B 2201/70706 with means for reducing the peak-to-average power ratio
H04B 2201/70707 Efficiency-related aspects
H04B 2201/70715 with application-specific features
H04B 2201/70716 Quadrature
H04B 2201/70718 Particular systems or standards
H04B 2201/70727 using fast Fourier transform
H04B 2201/70728 Frequency aspects
H04B 2201/7073 Direct sequence modulation synchronisation
H04B 2201/7097 Direct sequence modulation interference

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

HUAWEI TECHNOLOGIES COMPANY CN 101,476
QUALCOMM US 101,139
SAMSUNG ELECTRONICS COMPANY KR 96,655
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
LG ELECTRONICS KR 55,253
HUAWEI TECHNOLOGIES COMPANY 54,181
SONY CORPORATION JP 35,309
ZTE CORPORATION CN 32,950
INTEL CORPORATION US 27,533
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498