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CPC Subgroup
H04M 9/027

Full Title

Arrangements for interconnection not involving centralised switching > involving a common line for all parties

Filing statistics

CPC H04M 9/027 belongs to the parent subclass H04M, which recorded 236,508 patent applications worldwide between 2013 and 2023. Annual filings declined from 19,559 in 2013 to 13,232 in 2023 (-32%), peaking at 28,340 applications in 2017. The most active applicants in class H04 are HUAWEI TECHNOLOGIES COMPANY (101,476 applications), QUALCOMM (101,139 applications) and SAMSUNG ELECTRONICS COMPANY (96,655 applications).

Source: EPO PATSTAT, worldwide filings

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498