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CPC Subgroup Additional Only
H04N 2201/02481

Single piece support, e.g. molded plastic support

Full Title

Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof > deleted > Arrangements for mounting or supporting elements within a scanning head (H04N2201/02406, H04N2201/03154 take precedence) > Mounting or supporting means > Single piece support, e.g. molded plastic support

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498