CPC Subgroup Additional Only
H04N 2201/0315 Details of integral heads not otherwise provided for
Full Title
Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof > deleted > for picture information pick-up > deleted > deleted > Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame > Details of integral heads not otherwise provided for
11 direct subcodes
Child Classifications
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- H04N 2201/03154 Additional internal supporting or reinforcing member
- H04N 2201/03158 Heat radiator
- H04N 2201/03162 Original guide plate
- H04N 2201/03166 Additional light shielding member
- H04N 2201/0317 Shape
- H04N 2201/03175 Position
- H04N 2201/03179 Frame
- H04N 2201/03183 Material
- H04N 2201/03187 Additional optical element
- H04N 2201/03191 Adhesive element
- H04N 2201/03195 Coating, e.g. light adsorbing layer
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498