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CPC Main Group
H04N 23/00

Cameras or camera modules comprising electronic image sensors; Control thereof

Filing statistics

CPC H04N 23/00 belongs to the parent subclass H04N, which recorded 864,508 patent applications worldwide between 2013 and 2023. Annual filings grew from 63,372 in 2013 to 69,353 in 2023 (+9%), peaking at 99,144 applications in 2020. The most active applicants in class H04 are HUAWEI TECHNOLOGIES COMPANY (101,476 applications), QUALCOMM (101,139 applications) and SAMSUNG ELECTRONICS COMPANY (96,655 applications).

Source: EPO PATSTAT, worldwide filings

14 direct subcodes

Child Classifications

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  • H04N 23/30 for generating image signals from X-rays
  • H04N 23/45 for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
  • H04N 23/56 provided with illuminating means
  • H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
  • H04N 23/58 Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
  • H04N 23/90 Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498