CPC Main Group
H04N 23/00 Cameras or camera modules comprising electronic image sensors; Control thereof
14 direct subcodes
Child Classifications
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- H04N 23/10 for generating image signals from different wavelengths
- H04N 23/20 for generating image signals from infrared radiation only
- H04N 23/30 for generating image signals from X-rays
- H04N 23/40 Circuit details for pick-up tubes
- H04N 23/45 for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
- H04N 23/50 Constructional details
- H04N 23/56 provided with illuminating means
- H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H04N 23/58 Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
- H04N 23/60 Control of cameras or camera modules
- H04N 23/70 Circuitry for compensating brightness variation in the scene
- H04N 23/80 Camera processing pipelines; Components thereof
- H04N 23/90 Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
- H04N 23/95 Computational photography systems, e.g. light-field imaging systems
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498