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CPC Subgroup
H04N 25/77

Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components

Full Title

Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith > Addressed sensors, e.g. MOS or CMOS sensors > Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components

3 direct subcodes

Child Classifications

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  • H04N 25/771 comprising storage means other than floating diffusion
  • H04N 25/778 comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498