CPC Main Group Additional Only
H04Q 2201/00 Constructional details of selecting arrangements
10 direct subcodes
Child Classifications
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- H04Q 2201/02 Details of frames
- H04Q 2201/04 Modular construction
- H04Q 2201/06 Cooling arrangements
- H04Q 2201/08 Pivotable parts
- H04Q 2201/10 Housing details
- H04Q 2201/12 Printed circuits
- H04Q 2201/14 Screening, grounding or crosstalk reduction details
- H04Q 2201/16 Coaxial cable connectors
- H04Q 2201/18 Rails
- H04Q 2201/80 in specific systems
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498