CPC Main Group Additional Only
H04R 2231/00 Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
2 direct subcodes
Child Classifications
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- H04R 2231/001 Moulding aspects of diaphragm or surround
- H04R 2231/003 Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498