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CPC Main Group Additional Only
H04R 2231/00

Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups

Filing statistics

CPC H04R 2231/00 belongs to the parent subclass H04R, which recorded 161,989 patent applications worldwide between 2013 and 2023. Annual filings grew from 9,314 in 2013 to 13,794 in 2023 (+48%), peaking at 18,978 applications in 2020. The most active applicants in class H04 are HUAWEI TECHNOLOGIES COMPANY (101,476 applications), QUALCOMM (101,139 applications) and SAMSUNG ELECTRONICS COMPANY (96,655 applications).

Source: EPO PATSTAT, worldwide filings

2 direct subcodes

Child Classifications

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  • H04R 2231/001 Moulding aspects of diaphragm or surround
  • H04R 2231/003 Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498