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CPC Subgroup Additional Only
H05B 2203/002

Heaters using a particular layout for the resistive material or resistive elements

Full Title

Aspects relating to Ohmic resistive heating covered by group H05B3/00 > Heaters using a particular layout for the resistive material or resistive elements

6 direct subcodes

Child Classifications

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  • H05B 2203/003 using serpentine layout
  • H05B 2203/004 using zigzag layout
  • H05B 2203/005 using multiple resistive elements or resistive zones isolated from each other
  • H05B 2203/006 using interdigitated electrodes
  • H05B 2203/007 using multiple electrically connected resistive elements or resistive zones
  • H05B 2203/008 with layout including a portion free of resistive material, e.g. communication window

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907