CPC Main Group
H05B 3/00 Ohmic-resistance heating
14 direct subcodes
Child Classifications
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- H05B 3/02 Details
- H05B 3/10 Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B 3/20 Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater (H05B3/62, H05B3/68, H05B3/78, H05B3/84 take precedence)
- H05B 3/40 Heating elements having the shape of rods or tubes (H05B3/62, H05B3/68, H05B3/78 take precedence)
- H05B 3/60 Heating arrangements wherein the heating current flows through granular powdered or fluid material, e.g. for salt-bath furnace, electrolytic heating (H05B3/38 takes precedence)
- H05B 3/62 Heating elements specially adapted for furnaces (H05B3/60 takes precedence; arrangements of elements for electric heating in or on furnaces using ohmic resistance heating F27D11/02)
- H05B 3/68 Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B 3/78 Heating arrangements specially adapted for immersion heating
- H05B 3/84 Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907