CPC Subgroup
H10P 50/64 of semiconductor materials
Full Title
Etching of wafers, substrates or parts of devices > Wet etching > of semiconductor materials
1 direct subcode
Child Classifications
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H10P 50/64 Etching of wafers, substrates or parts of devices > Wet etching > of semiconductor materials
1 direct subcode
Navigate with arrow keys, Enter to open