H10P 72/0431 Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
Description
H10P72/0431 covers apparatus for the thermal treatment of semiconductor wafers, substrates or devices, classified within the handling and holding arrangements of H10P72/00. Typical equipment includes diffusion and annealing furnaces, bake plates and rapid thermal processing chambers used during device manufacture. Subdivisions distinguish apparatus by the dominant heat-transfer mechanism: mainly by conduction (H10P72/0432), by convection (H10P72/0434) or by radiation (H10P72/0436). Apparatus for fluid treatment or for mechanical grinding and cutting is classified in the sibling groups of H10P72/04.
Filing statistics
The most active applicants in class H10 are SAMSUNG DISPLAY (38,446 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (30,922 applications) and SAMSUNG ELECTRONICS COMPANY (30,059 applications).
Source: EPO PATSTAT, worldwide filings
3 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697