CPC Main Group
H10P 72/00 Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
6 direct subcodes
Child Classifications
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- H10P 72/10 using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P 72/30 for conveying, e.g. between different workstations
- H10P 72/50 for positioning, orientation or alignment
- H10P 72/70 for supporting or gripping