CPC Main Group
H10P 72/00 Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
Filing statistics
The most active applicants in class H10 are SAMSUNG DISPLAY (38,446 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (30,922 applications) and SAMSUNG ELECTRONICS COMPANY (30,059 applications).
Source: EPO PATSTAT, worldwide filings
6 direct subcodes
Child Classifications
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- H10P 72/10 using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P 72/30 for conveying, e.g. between different workstations
- H10P 72/50 for positioning, orientation or alignment
- H10P 72/70 for supporting or gripping
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697