CPC Main Group
H10P 72/00 Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
6 direct subcodes
Child Classifications
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- H10P 72/10 using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P 72/30 for conveying, e.g. between different workstations
- H10P 72/50 for positioning, orientation or alignment
- H10P 72/70 for supporting or gripping
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697