CPC Subgroup
H10P 90/21 Full Title
Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
1 direct subcode
Child Classifications
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H10P 90/21 Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
1 direct subcode
Navigate with arrow keys, Enter to open