DIFF Subgroup
H10P 90/21 Full Title
Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.
H10P 90/21 Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.