CPC Subgroup Additional Only
Y10S 165/184 Indirect-contact condenser
Full Title
Heat exchange > Indirect-contact condenser
12 direct subcodes
Child Classifications
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- Y10S 165/185 having stacked plates forming flow channel therebetween
- Y10S 165/187 having pump downstream of condenser
- Y10S 165/192 including means to heat collected condensate
- Y10S 165/193 First-stage condenser serially connected to second-stage condenser
- Y10S 165/195 including condensate collecting tray connected to condensate drain conduit to divert condensate around a section of heat transfer surface
- Y10S 165/196 Baffle defines flow passage within header for condensate to bypass portion of vapor flow path
- Y10S 165/197 including means for removing condensate from vapor flow path to bypass portion of vapor flow path
- Y10S 165/198 Condensate guiding means attached to heat transfer surface
- Y10S 165/202 Vapor flow passage between vapor inlet and outlet has decreasing cross- sectional area
- Y10S 165/204 including a direct-contact heat exchange chamber
- Y10S 165/205 Space for condensable vapor surrounds space for coolant
- Y10S 165/217 Space for coolant surrounds space for vapor
Top Applicants
Top 10 applicants by patent filingsfor class Y10, 2013–2023, worldwide · Source: EPO PATSTAT
- BOEING COMPANY US 2,373
- FORD GLOBAL TECHNOLOGIES US 2,244
- HYUNDAI MOTOR COMPANY KR 2,186
- TOYOTA MOTOR CORPORATION JP 1,997
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 1,837
- GE (GENERAL ELECTRIC COMPANY) US 1,794
- SAMSUNG ELECTRONICS COMPANY KR 1,705
- CORNING US 1,569
- TOYOTA MOTOR CORPORATION 1,403
- LG CHEM KR 1,364