CPC Subgroup Additional Only
Y10T 156/1111 Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
Full Title
Adhesive bonding and miscellaneous chemical manufacture > Methods of delaminating, per se; i.e. , separating at bonding face > Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
1 direct subcode
Child Classifications
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- Y10T 156/1116 Using specified organic delamination solvent
Top Applicants
Top 10 applicants by patent filingsfor class Y10, 2013–2023, worldwide · Source: EPO PATSTAT
- BOEING COMPANY US 2,373
- FORD GLOBAL TECHNOLOGIES US 2,244
- HYUNDAI MOTOR COMPANY KR 2,186
- TOYOTA MOTOR CORPORATION JP 1,997
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 1,837
- GE (GENERAL ELECTRIC COMPANY) US 1,794
- SAMSUNG ELECTRONICS COMPANY KR 1,705
- CORNING US 1,569
- TOYOTA MOTOR CORPORATION 1,403
- LG CHEM KR 1,364