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CPC Subgroup Additional Only
Y10T 156/1309

and securing separate part over hole or aperture

Full Title

Adhesive bonding and miscellaneous chemical manufacture > Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing > Means making hole or aperture in part to be laminated > and securing separate part over hole or aperture

Top Applicants

Top 10 applicants by patent filingsfor class Y10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. BOEING COMPANY US 2,373
  2. FORD GLOBAL TECHNOLOGIES US 2,244
  3. HYUNDAI MOTOR COMPANY KR 2,186
  4. TOYOTA MOTOR CORPORATION JP 1,997
  5. 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 1,837
  6. GE (GENERAL ELECTRIC COMPANY) US 1,794
  7. SAMSUNG ELECTRONICS COMPANY KR 1,705
  8. CORNING US 1,569
  9. TOYOTA MOTOR CORPORATION 1,403
  10. LG CHEM KR 1,364