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CPC Subgroup Additional Only
Y10T 156/1322

Severing before bonding or assembling of parts

Full Title

Adhesive bonding and miscellaneous chemical manufacture > Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing > Means feeding plural workpieces to be joined > Severing before bonding or assembling of parts

3 direct subcodes

Child Classifications

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  • Y10T 156/1326 Severing means or member secured thereto also bonds
  • Y10T 156/1339 Delivering cut part in sequence to serially conveyed articles

Top Applicants

Top 10 applicants by patent filingsfor class Y10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. BOEING COMPANY US 2,373
  2. FORD GLOBAL TECHNOLOGIES US 2,244
  3. HYUNDAI MOTOR COMPANY KR 2,186
  4. TOYOTA MOTOR CORPORATION JP 1,997
  5. 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 1,837
  6. GE (GENERAL ELECTRIC COMPANY) US 1,794
  7. SAMSUNG ELECTRONICS COMPANY KR 1,705
  8. CORNING US 1,569
  9. TOYOTA MOTOR CORPORATION 1,403
  10. LG CHEM KR 1,364