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DIFF Subgroup
B26D 7/10

by heating (with Laser B23K26/00; severing by heating B26F)

Introduced: September 1968

Title

Titles differ between systems:

IPC: by heating

CPC: by heating (with Laser B23K26/00; severing by heating B26F)

Full Title

Full titles differ between systems:

IPC:

Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting > Means for treating work or cutting member to facilitate cutting > by heating

CPC:

Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting (cutters B26D1/00; arrangements for guiding hand cutting tools B26B29/06; punching tools or dies, cutting-out knives or dies B26F) > Means for treating work or cutting member to facilitate cutting (tensioning band cutters B26D1/48) > by heating (with Laser B23K26/00; severing by heating B26F)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class B26,2013–2023, worldwide · Source: EPO PATSTAT

  1. GILLETTE COMPANY US 1,650
  2. PHILIPS ELECTRONICS NL 1,359
  3. BIC-VIOLEX GR 618
  4. PHILIPS ELECTRONICS 373
  5. BRAUN DE 311
  6. DORCO COMPANY KR 298
  7. WEBER MASCHINENBAUBREIDENBACH DE 278
  8. GILLETTE COMPANY 277
  9. URSCHEL LABORATORIES US 255
  10. SGCC(STATE GRID CORPORATION OF CHINA) 241

Top Applicants (CPC)

Class B26,2013–2023, worldwide · Source: EPO PATSTAT

  1. GILLETTE COMPANY US 1,745
  2. PHILIPS ELECTRONICS NL 1,410
  3. BIC-VIOLEX GR 638
  4. PHILIPS ELECTRONICS 378
  5. DISCO CORPORATION JP 355
  6. BRAUN DE 325
  7. WEBER MASCHINENBAUBREIDENBACH DE 304
  8. DORCO COMPANY KR 297
  9. GILLETTE COMPANY 290
  10. URSCHEL LABORATORIES US 264