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DIFF Subgroup
B26F 1/04

with selectively-operable punches

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor > Perforating by punching, e.g. with relatively-reciprocating punch and bed > with selectively-operable punches

CPC:

Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor (perforating by laser beam B23K26/00; subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04; perforating by sand-blasting B24C; punching cards or tapes for statistical and record purposes G06K1/00) > Perforating by punching, e.g. with relatively-reciprocating punch and bed > with selectively-operable punches

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class B26,2013–2023, worldwide · Source: EPO PATSTAT

  1. GILLETTE COMPANY US 1,650
  2. PHILIPS ELECTRONICS NL 1,359
  3. BIC-VIOLEX GR 618
  4. PHILIPS ELECTRONICS 373
  5. BRAUN DE 311
  6. DORCO COMPANY KR 298
  7. WEBER MASCHINENBAUBREIDENBACH DE 278
  8. GILLETTE COMPANY 277
  9. URSCHEL LABORATORIES US 255
  10. SGCC(STATE GRID CORPORATION OF CHINA) 241

Top Applicants (CPC)

Class B26,2013–2023, worldwide · Source: EPO PATSTAT

  1. GILLETTE COMPANY US 1,745
  2. PHILIPS ELECTRONICS NL 1,410
  3. BIC-VIOLEX GR 638
  4. PHILIPS ELECTRONICS 378
  5. DISCO CORPORATION JP 355
  6. BRAUN DE 325
  7. WEBER MASCHINENBAUBREIDENBACH DE 304
  8. DORCO COMPANY KR 297
  9. GILLETTE COMPANY 290
  10. URSCHEL LABORATORIES US 264