B26F 1/31 by radiation (by laser beam B23K26/00)
Introduced: January 1980
Title
Titles differ between systems:
IPC: by radiation
CPC: by radiation (by laser beam B23K26/00)
Full Title
Full titles differ between systems:
Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor > Perforating by non-mechanical means, e.g. by fluid jet > by radiation
Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor (perforating by laser beam B23K26/00; subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04; perforating by sand-blasting B24C; punching cards or tapes for statistical and record purposes G06K1/00) > Perforating by non-mechanical means, e.g. by fluid jet > by radiation (by laser beam B23K26/00)
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class B26,2013–2023, worldwide · Source: EPO PATSTAT
- GILLETTE COMPANY US 1,650
- PHILIPS ELECTRONICS NL 1,359
- BIC-VIOLEX GR 618
- PHILIPS ELECTRONICS 373
- BRAUN DE 311
- DORCO COMPANY KR 298
- WEBER MASCHINENBAUBREIDENBACH DE 278
- GILLETTE COMPANY 277
- URSCHEL LABORATORIES US 255
- SGCC(STATE GRID CORPORATION OF CHINA) 241
Top Applicants (CPC)
Class B26,2013–2023, worldwide · Source: EPO PATSTAT
- GILLETTE COMPANY US 1,745
- PHILIPS ELECTRONICS NL 1,410
- BIC-VIOLEX GR 638
- PHILIPS ELECTRONICS 378
- DISCO CORPORATION JP 355
- BRAUN DE 325
- WEBER MASCHINENBAUBREIDENBACH DE 304
- DORCO COMPANY KR 297
- GILLETTE COMPANY 290
- URSCHEL LABORATORIES US 264