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DIFF Subgroup Additional Only
B26F 2001/4445

Full Title

Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor (perforating by laser beam B23K26/00; subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04; perforating by sand-blasting B24C; punching cards or tapes for statistical and record purposes G06K1/00) > Cutting-out; Stamping-out > Cutters therefor; Dies therefor

Top Applicants

Top Applicants (IPC)

Class B26,2013–2023, worldwide · Source: EPO PATSTAT

  1. GILLETTE COMPANY US 1,650
  2. PHILIPS ELECTRONICS NL 1,359
  3. BIC-VIOLEX GR 618
  4. PHILIPS ELECTRONICS 373
  5. BRAUN DE 311
  6. DORCO COMPANY KR 298
  7. WEBER MASCHINENBAUBREIDENBACH DE 278
  8. GILLETTE COMPANY 277
  9. URSCHEL LABORATORIES US 255
  10. SGCC(STATE GRID CORPORATION OF CHINA) 241

Top Applicants (CPC)

Class B26,2013–2023, worldwide · Source: EPO PATSTAT

  1. GILLETTE COMPANY US 1,745
  2. PHILIPS ELECTRONICS NL 1,410
  3. BIC-VIOLEX GR 638
  4. PHILIPS ELECTRONICS 378
  5. DISCO CORPORATION JP 355
  6. BRAUN DE 325
  7. WEBER MASCHINENBAUBREIDENBACH DE 304
  8. DORCO COMPANY KR 297
  9. GILLETTE COMPANY 290
  10. URSCHEL LABORATORIES US 264