B28B 7/10 Moulds with means incorporated therein, or carried thereby, for ejecting the moulded article ( devices, not forming part of the mould, for ejecting the moulded article B28B13/06)
Introduced: September 1968
Title
Titles differ between systems:
IPC: Moulds with means incorporated therein, or carried thereby, for ejecting the moulded article
CPC: Moulds with means incorporated therein, or carried thereby, for ejecting the moulded article ( devices, not forming part of the mould, for ejecting the moulded article B28B13/06)
Full Title
Full titles differ between systems:
Moulds; Cores; Mandrels > Moulds with means incorporated therein, or carried thereby, for ejecting the moulded article
Moulds; Cores; Mandrels (specially adapted for the production of the tubular articles B28B21/00; ) > Moulds with means incorporated therein, or carried thereby, for ejecting the moulded article ( devices, not forming part of the mould, for ejecting the moulded article B28B13/06)
IPC and CPC are identically structured here. All 1 subcodes exist in both systems.
Child Classifications
Navigate with arrow keys, Enter to open
Top Applicants
Top Applicants (IPC)
Class B28,2013–2023, worldwide · Source: EPO PATSTAT
- MITSUBOSHI DIAMOND INDUSTRIAL COMPANY 868
- QINGDAO GAOCE TECHNOLOGY COMPANY 678
- DISCO CORPORATION JP 500
- ZHOU ZHAODI 500
- MITSUBOSHI DIAMOND INDUSTRIAL COMPANY JP 456
- HILTI LI 455
- CORNING US 407
- UNITED STATES GYPSUM COMPANY US 375
- ZHENGZHOU YUAN DONG REFRACTORIES COMPANY 370
- HUNAN SANY KUAIERJU RESIDENTIAL INDUSTRY COMPANY 351
Top Applicants (CPC)
Class B28,2013–2023, worldwide · Source: EPO PATSTAT
- DISCO CORPORATION JP 1,471
- HILTI LI 575
- CORNING US 544
- MITSUBOSHI DIAMOND INDUSTRIAL COMPANY JP 518
- UNITED STATES GYPSUM COMPANY US 485
- DISCO ABRASIVE SYSTEM 459
- GE (GENERAL ELECTRIC COMPANY) US 454
- MITSUBOSHI DIAMOND INDUSTRIAL COMPANY 439
- DISCO CORPORATION 403
- NGK INSULATORS JP 308