DIFF Subgroup
B32B 37/28 involving assembly of non-flat intermediate products which are flattened at a later step, e.g. tubes
Introduced: January 2006
Full Title
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding > involving assembly of non-flat intermediate products which are flattened at a later step, e.g. tubes
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class B32,2013–2023, worldwide · Source: EPO PATSTAT
- NITTO DENKO CORPORATION JP 4,719
- DNP (DAINIPPON PRINTING COMPANY) 3,989
- SAINT-GOBAIN GLASS FR 3,695
- NITTO DENKO CORPORATION 3,002
- DOW GLOBAL TECHNOLOGIES US 2,809
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 2,679
- FUJIFILM JP 2,360
- TOPPAN PRINTING COMPANY 2,310
- CORNING US 2,168
- SEKISUI CHEMICAL COMPANY JP 2,115
Top Applicants (CPC)
Class B32,2013–2023, worldwide · Source: EPO PATSTAT
- NITTO DENKO CORPORATION JP 5,666
- SAINT-GOBAIN GLASS FR 4,491
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 3,703
- DOW GLOBAL TECHNOLOGIES US 3,403
- NITTO DENKO CORPORATION 3,009
- FUJIFILM JP 2,629
- CORNING US 2,623
- LG CHEM KR 2,576
- SEKISUI CHEMICAL COMPANY JP 2,482
- TORAY INDUSTRIES JP 2,189