Skip to content
Search Classifications
Search for IPC and CPC classification codes or keywords
DIFF Subgroup
B32B 7/05

the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)

Introduced: January 2019

Title

Titles differ between systems:

IPC: the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection

CPC: the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)

Full Title

Full titles differ between systems:

IPC:

Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers > Interconnection of layers > the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection

CPC:

Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers > Interconnection of layers > the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class B32,2013–2023, worldwide · Source: EPO PATSTAT

  1. NITTO DENKO CORPORATION JP 4,719
  2. DNP (DAINIPPON PRINTING COMPANY) 3,989
  3. SAINT-GOBAIN GLASS FR 3,695
  4. NITTO DENKO CORPORATION 3,002
  5. DOW GLOBAL TECHNOLOGIES US 2,809
  6. 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 2,679
  7. FUJIFILM JP 2,360
  8. TOPPAN PRINTING COMPANY 2,310
  9. CORNING US 2,168
  10. SEKISUI CHEMICAL COMPANY JP 2,115

Top Applicants (CPC)

Class B32,2013–2023, worldwide · Source: EPO PATSTAT

  1. NITTO DENKO CORPORATION JP 5,666
  2. SAINT-GOBAIN GLASS FR 4,491
  3. 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 3,703
  4. DOW GLOBAL TECHNOLOGIES US 3,403
  5. NITTO DENKO CORPORATION 3,009
  6. FUJIFILM JP 2,629
  7. CORNING US 2,623
  8. LG CHEM KR 2,576
  9. SEKISUI CHEMICAL COMPANY JP 2,482
  10. TORAY INDUSTRIES JP 2,189