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DIFF Subgroup
B64U 20/87

Mounting of imaging devices, e.g. mounting of gimbals

Introduced: January 2023

Full Title

Full titles differ between systems:

IPC:

Constructional aspects of UAVs > Arrangement of on-board electronics, e.g. avionics systems or wiring > Mounting of imaging devices, e.g. mounting of gimbals

CPC:

Constructional aspects of UAVs (of lift-producing means B64U30/00) > Arrangement of on-board electronics, e.g. avionics systems or wiring > Mounting of imaging devices, e.g. mounting of gimbals

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class B64,2013–2023, worldwide · Source: EPO PATSTAT

  1. BOEING COMPANY US 8,583
  2. AIRBUS OPERATIONS DE 3,430
  3. AIRBUS OPERATIONS FR 2,757
  4. HAMILTON SUNDSTRAND US 2,332
  5. SZ DJI TECHNOLOGY COMPANY CN 2,109
  6. AIRBUS OPERATIONS GB 2,084
  7. GOODRICH CORPORATION US 2,053
  8. XI'AN AIRCRAFT DESIGN INSTITUTE OF AVIATION INDUSTRY CORPORATION OF CHINA 1,938
  9. BOEING COMPANY 1,816
  10. NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS 1,589

Top Applicants (CPC)

Class B64,2013–2023, worldwide · Source: EPO PATSTAT

  1. BOEING COMPANY US 9,861
  2. AIRBUS OPERATIONS DE 3,766
  3. AIRBUS OPERATIONS FR 3,112
  4. SZ DJI TECHNOLOGY COMPANY CN 2,840
  5. HAMILTON SUNDSTRAND US 2,753
  6. GOODRICH CORPORATION US 2,427
  7. AIRBUS OPERATIONS GB 2,356
  8. BOEING COMPANY 2,057
  9. SAFRAN AIRCRAFT ENGINES FR 1,815
  10. AIRBUS OPERATIONS 1,723