C23C 18/18 Pretreatment of the material to be coated
Introduced: January 1985
Full Title
Full titles differ between systems:
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating > by reduction or substitution, i.e. electroless plating > Pretreatment of the material to be coated
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating > by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence) > Pretreatment of the material to be coated
CPC subdivides this area 3x more granularly than IPC with 2 additional codes.
2 codes are CPC-only extensions.
IPC defines codes here since 1985.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 8,096
- TOKYO ELECTRON JP 3,985
- CHINESE ACADEMY OF SCIENCES 2,842
- LAM RESEARCH CORPORATION US 2,654
- TOKYO ELECTRON 2,540
- NIPPON STEEL CORPORATION JP 2,465
- JFE STEEL JP 2,368
- ASM IP HOLDING NL 2,092
- APPLIED MATERIALS 1,877
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782
Top Applicants (CPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110