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PCE
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DIFF Subgroup
C23C 18/40

using reducing agents

Introduced: January 1985

Full Title

Full titles differ between systems:

IPC:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating > by reduction or substitution, i.e. electroless plating > Coating with metals > Coating with copper > using reducing agents

CPC:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating > by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence) > Coating with metals > Coating with copper > using reducing agents

Of 1 combined children, 0 exist in both systems.

1 codes are CPC-only extensions.

Child Classifications

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Top Applicants

Top Applicants (IPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 8,096
  2. TOKYO ELECTRON JP 3,985
  3. CHINESE ACADEMY OF SCIENCES 2,842
  4. LAM RESEARCH CORPORATION US 2,654
  5. TOKYO ELECTRON 2,540
  6. NIPPON STEEL CORPORATION JP 2,465
  7. JFE STEEL JP 2,368
  8. ASM IP HOLDING NL 2,092
  9. APPLIED MATERIALS 1,877
  10. POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782

Top Applicants (CPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110