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DIFF Subgroup
C23F 1/08

Apparatus, e.g. for photomechanical printing surfaces (photo- mechanical reproduction G03F)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Apparatus, e.g. for photomechanical printing surfaces

CPC: Apparatus, e.g. for photomechanical printing surfaces (photo- mechanical reproduction G03F)

Full Title

Full titles differ between systems:

IPC:

Etching metallic material by chemical means > Apparatus, e.g. for photomechanical printing surfaces

CPC:

Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) > Apparatus, e.g. for photomechanical printing surfaces (photo- mechanical reproduction G03F)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 8,096
  2. TOKYO ELECTRON JP 3,985
  3. CHINESE ACADEMY OF SCIENCES 2,842
  4. LAM RESEARCH CORPORATION US 2,654
  5. TOKYO ELECTRON 2,540
  6. NIPPON STEEL CORPORATION JP 2,465
  7. JFE STEEL JP 2,368
  8. ASM IP HOLDING NL 2,092
  9. APPLIED MATERIALS 1,877
  10. POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782

Top Applicants (CPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110