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DIFF Subgroup
C23F 1/28

for etching iron group metals

Introduced: January 1985

Full Title

Full titles differ between systems:

IPC:

Etching metallic material by chemical means > Etching compositions > Aqueous compositions > Acidic compositions > for etching iron group metals

CPC:

Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) > Etching compositions (C23F1/44 takes precedence) > Aqueous compositions > Acidic compositions (C23F1/42 takes precedence) > for etching iron group metals

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 8,096
  2. TOKYO ELECTRON JP 3,985
  3. CHINESE ACADEMY OF SCIENCES 2,842
  4. LAM RESEARCH CORPORATION US 2,654
  5. TOKYO ELECTRON 2,540
  6. NIPPON STEEL CORPORATION JP 2,465
  7. JFE STEEL JP 2,368
  8. ASM IP HOLDING NL 2,092
  9. APPLIED MATERIALS 1,877
  10. POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782

Top Applicants (CPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110