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DIFF Subgroup
C23F 1/32

Alkaline compositions (C23F1/42 takes precedence)

Introduced: January 1985

Title

Titles differ between systems:

IPC: Alkaline compositions

CPC: Alkaline compositions (C23F1/42 takes precedence)

Full Title

Full titles differ between systems:

IPC:

Etching metallic material by chemical means > Etching compositions > Aqueous compositions > Alkaline compositions

CPC:

Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) > Etching compositions (C23F1/44 takes precedence) > Aqueous compositions > Alkaline compositions (C23F1/42 takes precedence)

IPC and CPC are identically structured here. All 4 subcodes exist in both systems.

IPC defines codes here since 1985.

Child Classifications

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  • C23F 1/34 for etching copper or alloys thereof since 1985 IPC+CPC Available in IPC and CPC
  • C23F 1/36 for etching aluminium or alloys thereof since 1985 IPC+CPC Available in IPC and CPC
  • C23F 1/38 for etching refractory metals since 1985 IPC+CPC Available in IPC and CPC
  • C23F 1/40 for etching other metallic material since 1985 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 8,096
  2. TOKYO ELECTRON JP 3,985
  3. CHINESE ACADEMY OF SCIENCES 2,842
  4. LAM RESEARCH CORPORATION US 2,654
  5. TOKYO ELECTRON 2,540
  6. NIPPON STEEL CORPORATION JP 2,465
  7. JFE STEEL JP 2,368
  8. ASM IP HOLDING NL 2,092
  9. APPLIED MATERIALS 1,877
  10. POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782

Top Applicants (CPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110