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DIFF Subgroup
D21H 27/32

with materials applied between the sheets (attaching together paper or cardboard sheets B31F5/00; adhesives C09J)

Introduced: January 1990

Title

Titles differ between systems:

IPC: with materials applied between the sheets

CPC: with materials applied between the sheets (attaching together paper or cardboard sheets B31F5/00; adhesives C09J)

Full Title

Full titles differ between systems:

IPC:

Special paper not otherwise provided for, e.g. made by multi-step processes > Multi-ply > with materials applied between the sheets

CPC:

Special paper not otherwise provided for, e.g. made by multi-step processes > Multi-ply (for surface covering D21H27/18; making on paper-making machines D21F9/00, D21F11/00) > with materials applied between the sheets (attaching together paper or cardboard sheets B31F5/00; adhesives C09J)

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

1 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1990.

Child Classifications

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Top Applicants

Top Applicants (IPC)

Class D21,2013–2023, worldwide · Source: EPO PATSTAT

  1. VOITH PATENT DE 1,809
  2. STORA ENSO FI 1,467
  3. KEMIRA FI 1,086
  4. KIMBERLY-CLARK CORPORATION US 935
  5. VALMET TECHNOLOGIES FI 924
  6. VALMET SE 904
  7. P&G (PROCTER & GAMBLE COMPANY) US 862
  8. OJI HOLDINGS CORPORATION 696
  9. OMYA INTERNATIONAL CH 584
  10. SOUTH CHINA UNIVERSITY OF TECHNOLOGY 571

Top Applicants (CPC)

Class D21,2013–2023, worldwide · Source: EPO PATSTAT

  1. VOITH PATENT DE 1,857
  2. STORA ENSO FI 1,552
  3. KEMIRA FI 1,173
  4. KIMBERLY-CLARK CORPORATION US 1,107
  5. VALMET TECHNOLOGIES FI 965
  6. VALMET SE 943
  7. P&G (PROCTER & GAMBLE COMPANY) US 941
  8. OMYA INTERNATIONAL CH 821
  9. UPM-KYMMENE CORPORATION FI 512
  10. SEIKO EPSON CORPORATION JP 501