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DIFF Subgroup
G01K 13/10

for measuring temperature within piled or stacked materials (by special arrangements for conducting heat from the object to the sensitive heat element G01K1/16)

Introduced: September 1968

Title

Titles differ between systems:

IPC: for measuring temperature within piled or stacked materials

CPC: for measuring temperature within piled or stacked materials (by special arrangements for conducting heat from the object to the sensitive heat element G01K1/16)

Full Title

Full titles differ between systems:

IPC:

Thermometers specially adapted for specific purposes > for measuring temperature within piled or stacked materials

CPC:

Thermometers specially adapted for specific purposes > for measuring temperature within piled or stacked materials (by special arrangements for conducting heat from the object to the sensitive heat element G01K1/16)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class G01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 41,447
  2. CHINESE ACADEMY OF SCIENCES 32,952
  3. ROBERT BOSCH DE 16,470
  4. SAMSUNG ELECTRONICS COMPANY KR 10,052
  5. SINOPEC (CHINA PETROCHEMICAL CORPORATION) 9,573
  6. ZHEJIANG UNIVERSITY 9,529
  7. GUANGDONG POWER GRID CORPORATION 8,615
  8. TSINGHUA UNIVERSITY 7,805
  9. HALLIBURTON ENERGY SERVICES GROUP US 7,796
  10. QUALCOMM US 7,171

Top Applicants (CPC)

Class G01,2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382