G01K 5/28 the material being a gas (contained in a hollow body having parts which are deformable or displaceable under the pressure developed by the material G01K5/32)
Introduced: September 1968
Title
Titles differ between systems:
IPC: the material being a gas
CPC: the material being a gas (contained in a hollow body having parts which are deformable or displaceable under the pressure developed by the material G01K5/32)
Full Title
Full titles differ between systems:
Measuring temperature based on the expansion or contraction of a material > the material being a gas
Measuring temperature based on the expansion or contraction of a material (G01K9/00 takes precedence; giving other than momentary value of temperature G01K3/00) > the material being a gas (contained in a hollow body having parts which are deformable or displaceable under the pressure developed by the material G01K5/32)
IPC and CPC are identically structured here. All 1 subcodes exist in both systems.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class G01,2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 41,447
- CHINESE ACADEMY OF SCIENCES 32,952
- ROBERT BOSCH DE 16,470
- SAMSUNG ELECTRONICS COMPANY KR 10,052
- SINOPEC (CHINA PETROCHEMICAL CORPORATION) 9,573
- ZHEJIANG UNIVERSITY 9,529
- GUANGDONG POWER GRID CORPORATION 8,615
- TSINGHUA UNIVERSITY 7,805
- HALLIBURTON ENERGY SERVICES GROUP US 7,796
- QUALCOMM US 7,171
Top Applicants (CPC)
Class G01,2013–2023, worldwide · Source: EPO PATSTAT
- CHINESE ACADEMY OF SCIENCES 21,460
- ROBERT BOSCH DE 17,801
- SGCC(STATE GRID CORPORATION OF CHINA) 17,347
- SAMSUNG ELECTRONICS COMPANY KR 13,192
- QUALCOMM US 9,900
- HALLIBURTON ENERGY SERVICES GROUP US 9,742
- PHILIPS ELECTRONICS NL 7,249
- MITSUBISHI ELECTRIC CORPORATION JP 6,503
- ZHEJIANG UNIVERSITY 6,414
- DENSO CORPORATION JP 6,382