Mounting of expansion boards

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Details not covered by groups and > Constructional details or arrangements > Packaging or power distribution > Internal mounting support structures, e.g. for supporting printed circuit boards > Mounting of expansion boards

CPC:

Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00 (architectures of general purpose stored program computers G06F15/76) > Constructional details or arrangements > Packaging or power distribution > Internal mounting support structures, e.g. for supporting printed circuit boards > Mounting of expansion boards

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

IPC defines codes here since 2026.

Child Classifications

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G06F 1/186 Securing of expansion boards in correspondence to slots provided at the computer enclosure since 2026 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G06,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 66,669
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
MICROSOFT TECHNOLOGY LICENSING US 41,918
GOOGLE US 32,969
SGCC(STATE GRID CORPORATION OF CHINA) 30,822
INTEL CORPORATION US 30,010
TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
HUAWEI TECHNOLOGIES COMPANY CN 26,079
APPLE US 21,891
HUAWEI TECHNOLOGIES COMPANY 20,505

Top Applicants (CPC)

Class G06,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 76,952
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
MICROSOFT TECHNOLOGY LICENSING US 44,778
GOOGLE US 35,735
INTEL CORPORATION US 32,087
HUAWEI TECHNOLOGIES COMPANY CN 30,572
TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
APPLE US 23,482
SGCC(STATE GRID CORPORATION OF CHINA) 22,548
HUAWEI TECHNOLOGIES COMPANY 20,917