DIFF Subgroup
G06F 18/211 Selection of the most significant subset of features
Introduced: January 2023
Full Title
Pattern recognition > Analysing > Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation > Selection of the most significant subset of features
IPC and CPC are identically structured here. All 3 subcodes exist in both systems.
IPC defines codes here since 2023.
Child Classifications
Navigate with arrow keys, Enter to open
- G06F 18/2111 by using evolutionary computational techniques, e.g. genetic algorithms since 2023 IPC+CPC Available in IPC and CPC
- G06F 18/2113 by ranking or filtering the set of features, e.g. using a measure of variance or of feature cross-correlation since 2023 IPC+CPC Available in IPC and CPC
- G06F 18/2115 by evaluating different subsets according to an optimisation criterion, e.g. class separability, forward selection or backward elimination since 2023 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G06,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 66,669
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
- MICROSOFT TECHNOLOGY LICENSING US 41,918
- GOOGLE US 32,969
- SGCC(STATE GRID CORPORATION OF CHINA) 30,822
- INTEL CORPORATION US 30,010
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
- HUAWEI TECHNOLOGIES COMPANY CN 26,079
- APPLE US 21,891
- HUAWEI TECHNOLOGIES COMPANY 20,505
Top Applicants (CPC)
Class G06,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 76,952
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
- MICROSOFT TECHNOLOGY LICENSING US 44,778
- GOOGLE US 35,735
- INTEL CORPORATION US 32,087
- HUAWEI TECHNOLOGIES COMPANY CN 30,572
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
- APPLE US 23,482
- SGCC(STATE GRID CORPORATION OF CHINA) 22,548
- HUAWEI TECHNOLOGIES COMPANY 20,917