G06G 7/56 for heat flow (G06G7/58 takes precedence)
Introduced: September 1968
Title
Titles differ between systems:
IPC: for heat flow
CPC: for heat flow (G06G7/58 takes precedence)
Full Title
Full titles differ between systems:
Devices in which the computing operation is performed by varying electric or magnetic quantities > Analogue computers for specific processes, systems, or devices, e.g. simulators > for heat flow
Devices in which the computing operation is performed by varying electric or magnetic quantities > Analogue computers for specific processes, systems or devices, e.g. simulators > for heat flow (G06G7/58 takes precedence)
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class G06,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 66,669
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
- MICROSOFT TECHNOLOGY LICENSING US 41,918
- GOOGLE US 32,969
- SGCC(STATE GRID CORPORATION OF CHINA) 30,822
- INTEL CORPORATION US 30,010
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
- HUAWEI TECHNOLOGIES COMPANY CN 26,079
- APPLE US 21,891
- HUAWEI TECHNOLOGIES COMPANY 20,505
Top Applicants (CPC)
Class G06,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 76,952
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
- MICROSOFT TECHNOLOGY LICENSING US 44,778
- GOOGLE US 35,735
- INTEL CORPORATION US 32,087
- HUAWEI TECHNOLOGIES COMPANY CN 30,572
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
- APPLE US 23,482
- SGCC(STATE GRID CORPORATION OF CHINA) 22,548
- HUAWEI TECHNOLOGIES COMPANY 20,917